In this configuration, copper filling (or less common, via capping) is required for all the microvias of the stack except for the outermost via, the same as a building having structural columns on each floor, here the copper filing is used for electrical connection between the microvias in the stack. They allow an electrical connection spanning more than one dielectric layer and at the same time maintain the small size of the standard microvia (as opposed, for example, to a skip via that must increase in size). Stacked microvias are microvias that are designed on top of each other. Please also check our electronic design services page. Please feel free to drop us an email with any comment or suggestion. However this guide is provided as-is with no warranty whatsoever, it is always best to check with your manufacturer his tolerances and capabilities before submitting a board for manufacture. It is believed to be accurate and up to date with the current fabrication capabilities. This guide is based on our 15+ years of knowledge in the PCB design industry. Changing the original design as an afterthought just before fabrication is never a good idea, it is always better to design proper vias during the layout of the board and submit correct Gerber files to the factory. However, the manufacturer has limited freedom because he is constrained by the original design. The manufacturer will inspect your vias prior to fabrication and may make changes to your original design if it does not meet his tolerances - many times without you even knowing about it! The manufacturer can change the drilled hole, annular ring, and the clearances around them. Vias and layer interconnect are the number one priority of the manufacturer.
PCB vias are fundamentally important in PCB design, it is important to understand this topic in detail because proper via design is key for a reliable PCB that is both cost-effective and can be produced with high yield.
0 kommentar(er)
